AdvancedTCA® Socket E AMD Blade

System Overview

Industry

Pinnacle Data Systems, Inc. offers a range of innovative services specifically targeted at the Telecommunications market space. PDSi works closely with Network Equipment Providers (NEPs) to develop NEP-specific turnkey solutions to help accelerate their time to market, improve their overall operating cost structure and provide a flexible and responsive support mechanism to meet their rapidly changing business requirements.

Technology

The AMD AdvancedTCA® blade can be quickly and easily integrated with other AdvancedTCA®, open-architecture, modular components to deploy high performance application solutions. The PICMG® 3.0 core AdvancedTCA® specification provides the advantages of being focused on the definition of an architecture that enables reduced development time and costs, offers high levels of modularity and configurability, improved power distribution and management, offers an advanced software infrastructure providing operating systems, application programming interface (API), and operation, administration, management, and provisioning (OAM&P).

Specifications

The PDSi AdvancedTCA® AMD board is a rugged, NEBS® compliant blade designed with the latest AMD Opteron™, dual-core CPU technology. It is designed to provide a highly configurable and scalable platform for deployment in carrier grade environments.

Turnkey system integration is available with PDSi’s AdvancedTCA® Integration Program. Please contact your local PDSi representative to discuss your specific program requirements.

Main Features

2 x 200 series AMD processors, 55w single or dual-core
4 DIMM sockets for a total of 8 GB of main DDR1 memory (PC3200)
2 x AMC .1 slot
IPMI v1.5 support
Dual Gigabit Ethernet base interface
Dual Gigabit Ethernet fabric interface
Boot from network or AMC disk drive
RoHS compliant

Front Panel I/O

Connectors

2 x USB
1 x Communication Port
2 x Gigabit Ethernet
1 x Reset Switch
LEDs 1 x Blue Hot Swap

LED

1 x Red OSS LED
1 x Green User LED
1 x Amber User LED

OS Support

SuSe™ Linux™ Enterprise Server 9.0

Physical Specifications

Single slot, 8U compatible
280mm x 322mm board form factor
30.48mm wide (1.2”) board to board pitch
PCB thickness: 1.6mm x 2.4mm
Alignment/key pins
EMC gasket on the left side of the board
Handle actuator micro switch for Hot Swap
Front panel (1mm thickness)
Two front panel handles
ZD connectors for Data Transport Plane
Dual redundant power feeds: -48VDC/-60VDC +/- 5%

Backplane Interconnect

Gigabit Ethernet

Chipsets

Marvell®
Marvell® Dual GigE
GigE Switch (TBD)

Thermal Profile

Maximum power dissipation of 200W per board per PICMG® 3.0 specification.

Electrical, Signaling and Mechanical Specifications

AdvancedTCA® Core Specification PICMG® 3.0

IPMI v1.5
NEBS® Level-3 and ETSI Installations
IPMC Intelligent Platform Management Controller

System Overview Specifications

*All other products or service names mentioned herein are trademarks of their respective owners. Specifications are subject to change without notice.

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